Show simple item record

Thermoreflectance imaging of current dynamics in high power SiGe heterojunction bipolar transistors

dc.contributor.authorChan, Paddy K. L.en_US
dc.contributor.authorPipe, Kevin P.en_US
dc.contributor.authorQin, Guoxuanen_US
dc.contributor.authorMa, Zhenqiangen_US
dc.date.accessioned2011-11-15T16:09:14Z
dc.date.available2011-11-15T16:09:14Z
dc.date.issued2006-12-04en_US
dc.identifier.citationChan, Paddy K. L.; Pipe, Kevin P.; Qin, Guoxuan; Ma, Zhenqiang (2006). "Thermoreflectance imaging of current dynamics in high power SiGe heterojunction bipolar transistors." Applied Physics Letters 89(23): 233521-233521-3. <http://hdl.handle.net/2027.42/87814>en_US
dc.identifier.urihttps://hdl.handle.net/2027.42/87814
dc.description.abstractBy generating high resolution two dimensional temperature images of electronic devices and linking heat dissipation to electrical current, the authors demonstrate that thermoreflectance measurements employing a charge-coupled device can provide a useful and nondestructive method for profiling current density in electronic devices. Here they apply this method to high power SiGe heterojunction bipolar transistors (HBTs) integrated in a commercial SiGe bipolar complementary metal-oxide-semiconductor platform, measuring the current carried by each subcell and quantifying current collapse under high-bias operation. They show that current hogging for a HBT with two emitter subcells can lead to one subcell carrying 81% of the total current.en_US
dc.publisherThe American Institute of Physicsen_US
dc.rights© The American Institute of Physicsen_US
dc.titleThermoreflectance imaging of current dynamics in high power SiGe heterojunction bipolar transistorsen_US
dc.typeArticleen_US
dc.subject.hlbsecondlevelPhysicsen_US
dc.subject.hlbtoplevelScienceen_US
dc.description.peerreviewedPeer Revieweden_US
dc.contributor.affiliationumDepartment of Mechanical Engineering, University of Michigan, Ann Arbor, Michigan 48109-2125en_US
dc.contributor.affiliationotherDepartment of Electrical and Computer Engineering, University of Wisconsin-Madison, Madison, Wisconsin 53706en_US
dc.description.bitstreamurlhttp://deepblue.lib.umich.edu/bitstream/2027.42/87814/2/233521_1.pdf
dc.identifier.doi10.1063/1.2402947en_US
dc.identifier.sourceApplied Physics Lettersen_US
dc.identifier.citedreferenceG. Wang, H. C. Yuan, and Z. Ma, IEEE Electron Device Lett. 27, 371 (2006).en_US
dc.identifier.citedreferenceB. P. Yan, C. C. Hsu, X. Q. Wang, and E. S. Yang, Appl. Phys. Lett. 85, 4505 (2004).en_US
dc.identifier.citedreferenceN. Chand, R. Fischer, T. Henderson, J. Klem, W. Kopp, and H. Morkoç, Appl. Phys. Lett. 45, 1086 (1984).en_US
dc.identifier.citedreferenceY. Zhu, J. Kwynam, M. Yangura, M. Hasegawa, T. Hasegawa, Y. Eguchi, Y. Amano, E. Suematsu, K. Sakuno, N. Matsumoto, H. Sato, and N. Hasizume, IEEE Trans. Electron Devices 48, 2640 (2001).en_US
dc.identifier.citedreferenceK. Y. Huang, Y. Li, and C. P. Lee, Microelectron. Eng. 75, 137 (2004).en_US
dc.identifier.citedreferenceW. Liu, IEEE Trans. Electron Devices 42, 1033 (1995).en_US
dc.identifier.citedreferenceW. Liu and A. Yukselm, IEEE Trans. Electron Devices 42, 358 (1995).en_US
dc.identifier.citedreferenceJ. W. Pomeroy, M. Kuball, D. J. Wallis, A. M. Keir, K. P. Hilton, R. S. Balmer, M. J. Uren, T. Martin, and P. J. Heard, Appl. Phys. Lett. 87, 103508 (2005).en_US
dc.identifier.citedreferenceJ. W. Pomeroy, M. Kuball, M. J. Uren, K. P. Hilton, R. S. Balmer, and T. Martin, Appl. Phys. Lett. 88, 023507 (2006).en_US
dc.identifier.citedreferenceD. Lüerßen, J. A. Hudgings, P. M. Mayer, and R. J. Ram, 21st Annual IEEE Semiconductor Thermal Measurement and Management Symposium (IEEE, San Jose, 2005), p. 253.en_US
dc.identifier.citedreferenceP. K. L. Chan, K. P. Pipe, Z. Mi, J. Yang, P. Bhattacharya, and D. Lüerßen, Appl. Phys. Lett. 89, 011110 (2006).en_US
dc.identifier.citedreferenceJ. S. Yuan, SiGe, GaAs, and InP Heterojunction Bipolar Transistors (Wiley, New York, 1999), Vol. 1, Chap. 7, p. 304.en_US
dc.identifier.citedreferenceK. Kurishima, S. Yamahata, H. Nakajima, H. Ito, and N. Watanabe, IEEE Electron Device Lett. 19, 303 (1998).en_US
dc.owningcollnamePhysics, Department of


Files in this item

Show simple item record

Remediation of Harmful Language

The University of Michigan Library aims to describe library materials in a way that respects the people and communities who create, use, and are represented in our collections. Report harmful or offensive language in catalog records, finding aids, or elsewhere in our collections anonymously through our metadata feedback form. More information at Remediation of Harmful Language.

Accessibility

If you are unable to use this file in its current format, please select the Contact Us link and we can modify it to make it more accessible to you.