Plasma deposition of thin carbonfluorine films on aligned carbon nanotube
dc.contributor.author | He, Peng | en_US |
dc.contributor.author | Shi, Donglu | en_US |
dc.contributor.author | Lian, Jie | en_US |
dc.contributor.author | Wang, L. M. | en_US |
dc.contributor.author | Ewing, Rodney C. | en_US |
dc.contributor.author | van Ooij, Wim J. | en_US |
dc.contributor.author | Li, W. Z. | en_US |
dc.contributor.author | Ren, Z. F. | en_US |
dc.date.accessioned | 2011-11-15T16:09:58Z | |
dc.date.available | 2011-11-15T16:09:58Z | |
dc.date.issued | 2005-01-24 | en_US |
dc.identifier.citation | He, Peng; Shi, Donglu; Lian, Jie; Wang, L. M.; Ewing, Rodney C.; van Ooij, Wim; Li, W. Z.; Ren, Z. F. (2005). "Plasma deposition of thin carbonfluorine films on aligned carbon nanotube." Applied Physics Letters 86(4): 043107-043107-3. <http://hdl.handle.net/2027.42/87850> | en_US |
dc.identifier.uri | https://hdl.handle.net/2027.42/87850 | |
dc.description.abstract | The thin film of carbonfluorine was deposited on the surfaces of aligned carbon nanotubes using a plasma polymerization treatment. High-resolution transmission electron microscopy images revealed that a thin film of the polymer layer (20 nm)(20nm) was uniformly deposited on the surfaces of the aligned carbon nanotubes. Time-of-flight secondary ion mass spectroscopy and Fourier transform infrared experiments identified the carbonfluorine thin films on the carbon nanotubes. The plasma deposition mechanism is discussed. | en_US |
dc.publisher | The American Institute of Physics | en_US |
dc.rights | © The American Institute of Physics | en_US |
dc.title | Plasma deposition of thin carbonfluorine films on aligned carbon nanotube | en_US |
dc.type | Article | en_US |
dc.subject.hlbsecondlevel | Physics | en_US |
dc.subject.hlbtoplevel | Science | en_US |
dc.description.peerreviewed | Peer Reviewed | en_US |
dc.contributor.affiliationum | Departments of Geological Sciences and Material Science & Engineering, University of Michigan, Ann Arbor, Michigan 48109 | en_US |
dc.contributor.affiliationother | Department of Mechanical Engineering, University of Cincinnati, Cincinnati, Ohio 45221 | en_US |
dc.contributor.affiliationother | Department of Chemical and Materials Engineering, University of Cincinnati, Cincinnati, Ohio 45221 | en_US |
dc.contributor.affiliationother | Department of Chemical and Materials Engineering, University of Cincinnati, Cincinnati, Ohio 45221 | en_US |
dc.contributor.affiliationother | Department of Physics, Florida International University, Miami, Florida 33199 | en_US |
dc.contributor.affiliationother | Department of Physics, Boston College, Boston, Massachusetts 02467 | en_US |
dc.description.bitstreamurl | http://deepblue.lib.umich.edu/bitstream/2027.42/87850/2/043107_1.pdf | |
dc.identifier.doi | 10.1063/1.1846957 | en_US |
dc.identifier.source | Applied Physics Letters | en_US |
dc.identifier.citedreference | R. W. Siegel, Nanostruct. Mater. 3, 1 (1993). | en_US |
dc.identifier.citedreference | G.C. Hadjipanayis and R.W. Siegel, Nanophase Materials, Synthesis-Properties-Applications (Kluwer, Dordrecht, 1994). | en_US |
dc.identifier.citedreference | G. M. Whitesides, J. P. Mathias, and C. T. Seto, Science 254, 1312 (1991). | en_US |
dc.identifier.citedreference | C. D. Stucky and J. E. MacDougall, Science 247, 669 (1990). | en_US |
dc.identifier.citedreference | H. Gleiter, Nanostruct. Mater. 6, 3 (1995). | en_US |
dc.identifier.citedreference | G. Timp, Nanotechnology (AIP, Melville, NY, 1998). | en_US |
dc.identifier.citedreference | Y. Bar-Cohen, 42nd AIAA Structures, Dynamics, and Materials Conference (SDM), Gossamer Spacecraft Forum (GSF), Seattle, WA, 2001, pp. 1–10. | en_US |
dc.identifier.citedreference | D. Shi, S. X. Wang, W. J. van Ooij, L. M. Wang, J. Zhao, and Z. Yu, Appl. Phys. Lett. 78, 1234 (2001). | en_US |
dc.identifier.citedreference | D. Shi, P. He, J. Lian, L. M. Wang, and W. J. Vanooij, J. Mater. Res. 17, 2555 (2002). | en_US |
dc.identifier.citedreference | D. Shi, P. He, S. X. Wang, W. J. van Ooij, L. M. Wang, J. Zhao, and Z. Yu, J. Mater. Res. 17, 981 (2002). | en_US |
dc.identifier.citedreference | D. Shi, J. Lian, P. He, L. M. Wang, W. J. van Ooij, M. Schulz, Y. J. Liu, and D. B. Mast, Appl. Phys. Lett. 81, 5216 (2002). | en_US |
dc.identifier.citedreference | D. Shi, J. Lian, P. He, L. M. Wang, W. J. Van Ooij, M. Schulz, Y. J. Liu, and D. B. Mast, Appl. Phys. Lett. 83, 5301 (2003). | en_US |
dc.identifier.citedreference | Y. Tu, Z. P. Huang, D. Z. Wang, J. G. Wen, and Z. F. Ren, Appl. Phys. Lett. 80, 4018 (2002). | en_US |
dc.identifier.citedreference | Z. F. Ren, Z. P. Huang, J. W. Xu, J. H. Wang, P. Bush, M. P. Siegal, and P. N. Provencio, Science 282, 1105 (1998). | en_US |
dc.identifier.citedreference | Z. P. Huang, J. W. Xu, Z. F. Ren, J. H. Wang, M. P. Siegal, and P. N. Provencio, Appl. Phys. Lett. 73, 3845 (1998). | en_US |
dc.identifier.citedreference | J. H. Chen, Z. P. Huang, D. Z. Wang, S. X. Yang, J. G. Wen, and Z. F. Ren, Appl. Phys. A: Mater. Sci. Process. 73, 129 (2001). | en_US |
dc.identifier.citedreference | W.J. van Ooij, S. Luo, N. Zhang, and A. Chityala, in Proceedings International Conference on Advanced Manufacturing Technology (Science, New York, 1999), p. 1572. | en_US |
dc.identifier.citedreference | W.J. van Ooij and A. Chityala, Surface Modification of Powders by Plasma Polymerization, edited by K. L. Mittal (VSP, Utrecht, 2000), p. 243. | en_US |
dc.identifier.citedreference | W.J. van Ooij, N. Zhang, and S. Guo, in Fundamental and Applied Aspects of Chemically Modified Surfaces, edited by J. P. Blitz and C. B. Little (Royal Society of Chemistry, Cambridge, UK, 1999), p. 191. | en_US |
dc.owningcollname | Physics, Department of |
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