Integration of Bulk Piezoelectric Materials into Microsystems.

Abstract

Bulk piezoelectric ceramics, compared to deposited piezoelectric thin-films, provide greater electromechanical coupling and charge capacity, which are highly desirable in many MEMS applications. In this thesis, a technology platform is developed for wafer-level integration of bulk piezoelectric substrates on silicon, with a final film thickness of 5-100μm. The characterized processes include reliable low-temperature (200˚C) AuIn diffusion bonding and parylene bonding of bulk-PZT on silicon, wafer-level lapping of bulk-PZT with high-uniformity (±0.5μm), and low-damage micro-machining of PZT films via dicing-saw patterning, laser ablation, and wet-etching. Preservation of ferroelectric and piezoelectric properties is confirmed with hysteresis and piezo-response measurements. The introduced technology offers higher material quality and unique advantages in fabrication flexibility over existing piezoelectric film deposition methods. In order to confirm the preserved bulk properties in the final film, diaphragm and cantilever beam actuators operating in the transverse-mode are designed, fabricated and tested. The diaphragm structure and electrode shapes/sizes are optimized for maximum deflection through finite-element simulations. During tests of fabricated devices, greater than 12μmPP displacement is obtained by actuation of a 1mm2 diaphragm at 111kHz with <7mW power consumption. The close match between test data and simulation results suggests that the piezoelectric properties of bulk-PZT5A are mostly preserved without any necessity of repolarization. Three generations of resonant vibration energy harvesters are designed, simulated and fabricated to demonstrate the competitive performance of the new fabrication process over traditional piezoelectric deposition systems. An unpackaged PZT/Si unimorph harvester with 27mm3 active device volume produces up to 205μW at 1.5g/154Hz. The prototypes have achieved the highest figure-of-merits (normalized-power-density × bandwidth) amongst previously reported inertial energy harvesters. The fabricated energy harvester is utilized to create an autonomous energy generation platform in 0.3cm3 by system-level integration of a 50-80% efficient power management IC, which incorporates a supply-independent bias circuitry, an active diode for low-dropout rectification, a bias-flip system for higher efficiency, and a trickle battery charger. The overall system does not require a pre-charged battery, and has power consumption of <1μW in active-mode (measured) and <5pA in sleep-mode (simulated). Under 1g vibration at 155Hz, a 70mF ultra-capacitor is charged from 0V to 1.85V in 50 minutes.