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Tips and Tricks for Characterizing Shape Memory Wire Part 5: Full‐Field Strain Measurement by Digital Image Correlation

dc.contributor.authorReedlunn, B.en_US
dc.contributor.authorDaly, S.en_US
dc.contributor.authorHector, L.en_US
dc.contributor.authorZavattieri, P.en_US
dc.contributor.authorShaw, J.en_US
dc.date.accessioned2013-06-18T18:32:34Z
dc.date.available2014-07-01T15:53:18Zen_US
dc.date.issued2013-05en_US
dc.identifier.citationReedlunn, B.; Daly, S.; Hector, L.; Zavattieri, P.; Shaw, J. (2013). "Tips and Tricks for Characterizing Shape Memory Wire Part 5: Full‐Field Strain Measurement by Digital Image Correlation." Experimental Techniques 37(3): 62-78. <http://hdl.handle.net/2027.42/98220>en_US
dc.identifier.issn0732-8818en_US
dc.identifier.issn1747-1567en_US
dc.identifier.urihttps://hdl.handle.net/2027.42/98220
dc.publisherBlackwell Publishing Ltden_US
dc.publisherWiley Periodicals, Inc.en_US
dc.subject.otherDigital Image Correlationen_US
dc.subject.otherMaterial Behaviorsen_US
dc.subject.otherFatigueen_US
dc.subject.otherStrainen_US
dc.titleTips and Tricks for Characterizing Shape Memory Wire Part 5: Full‐Field Strain Measurement by Digital Image Correlationen_US
dc.typeArticleen_US
dc.rights.robotsIndexNoFollowen_US
dc.subject.hlbsecondlevelMechanical Engineeringen_US
dc.subject.hlbtoplevelEngineeringen_US
dc.description.peerreviewedPeer Revieweden_US
dc.contributor.affiliationumDepartment of Aerospace Engineering, The University of Michigan, Ann Arbor, MIen_US
dc.contributor.affiliationumDepartment of Mechanical Engineering, University of Michigan, Ann Arbor, MIen_US
dc.contributor.affiliationotherChemical Sciences and Materials Systems Laboratory, General Motors R&D Center, Warren, MIen_US
dc.contributor.affiliationotherSchool of Civil Engineering, Purdue University, West Lafayette, INen_US
dc.description.bitstreamurlhttp://deepblue.lib.umich.edu/bitstream/2027.42/98220/1/ext717.pdf
dc.identifier.doi10.1111/j.1747-1567.2011.00717.xen_US
dc.identifier.sourceExperimental Techniquesen_US
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dc.owningcollnameInterdisciplinary and Peer-Reviewed


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