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Microencapsulation of imidazole curing agent by solvent evaporation method using W/O/W emulsion
dc.contributor.authorShin, Min Jaeen_US
dc.contributor.authorShin, Young Jaeen_US
dc.contributor.authorHwang, Seung Wonen_US
dc.contributor.authorShin, Jae Supen_US
dc.date.accessioned2013-06-18T18:33:11Z
dc.date.available2014-10-06T19:17:43Zen_US
dc.date.issued2013-08-05en_US
dc.identifier.citationShin, Min Jae; Shin, Young Jae; Hwang, Seung Won; Shin, Jae Sup (2013). "Microencapsulation of imidazole curing agent by solvent evaporation method using W/O/W emulsion." Journal of Applied Polymer Science 129(3): 1036-1044. <http://hdl.handle.net/2027.42/98341>en_US
dc.identifier.issn0021-8995en_US
dc.identifier.issn1097-4628en_US
dc.identifier.urihttps://hdl.handle.net/2027.42/98341
dc.description.abstractThe epoxy–imidazole resin system is used to form the anisotropic conducting film. The latent character of the system is very significant. In this study, imidazole (Im) or 2‐methylimidazole (2MI) was encapsulated for the latent curing system to use in the reaction of epoxy resin. Polycaprolactone was used as a wall material, and the solvent evaporation method was used to form the microcapsule using W/O/W emulsion. The shelf life of the microcapsules was studied for the epoxy resin, and the curing behavior of the microcapsules for epoxy resin was examined using a differential scanning calorimeter. The curing times at 150 and 180°C were estimated using an indentation method. The microcapsules of Im or 2MI exhibited a long shelf life for epoxy resin. When comparing the results of the previous methods with the results of this study using the W/O/W emulsion, finer microcapsules were formed and the microcapsule has longer shelf life. © 2012 Wiley Periodicals, Inc. J. Appl. Polym. Sci., 2013en_US
dc.publisherWiley Subscription Services, Inc., A Wiley Companyen_US
dc.subject.otherCuring Agenten_US
dc.subject.otherImidazoleen_US
dc.subject.otherEpoxy Resinen_US
dc.subject.otherMicroencapsulationen_US
dc.subject.otherSolvent Evaporation Methoden_US
dc.titleMicroencapsulation of imidazole curing agent by solvent evaporation method using W/O/W emulsionen_US
dc.typeArticleen_US
dc.rights.robotsIndexNoFollowen_US
dc.subject.hlbsecondlevelChemical Engineeringen_US
dc.subject.hlbsecondlevelChemistryen_US
dc.subject.hlbsecondlevelManagementen_US
dc.subject.hlbtoplevelEngineeringen_US
dc.subject.hlbtoplevelBusiness and Economicsen_US
dc.subject.hlbtoplevelScienceen_US
dc.description.peerreviewedPeer Revieweden_US
dc.contributor.affiliationumMacromolecular Science and Engineering, University of Michigan, Ann Arbor, Michigan 48109, USAen_US
dc.contributor.affiliationotherDepartment of Chemistry, Chungbuk National University, Cheongju, Chungbuk 361‐763, Koreaen_US
dc.contributor.affiliationotherDepartment of Chemistry, Chungbuk National University, Cheongju, Chungbuk 361‐763, Koreaen_US
dc.contributor.affiliationotherDepartment of Chemical and Biomolecular Engineering, KAIST, Daejeon 305‐701, Koreaen_US
dc.description.bitstreamurlhttp://deepblue.lib.umich.edu/bitstream/2027.42/98341/1/38767_ftp.pdf
dc.identifier.doi10.1002/app.38767en_US
dc.identifier.sourceJournal of Applied Polymer Scienceen_US
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dc.owningcollnameInterdisciplinary and Peer-Reviewed


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