Millimeter-Scale Encapsulation of Wireless Resonators for Environmental and Biomedical Sensing Applications

Abstract

Wireless magnetoelastic resonators are useful for remote mapping and sensing in environments that are harsh or otherwise difficult to access. Compared to other wireless resonators, magnetoelastic devices are attractive because of their inherently wireless nature, and their ability to operate passively without a power source, integrated circuitry, or antenna. An open challenge for using miniaturized magnetoelastic resonators is application-tailored encapsulation and packaging. General packaging considerations for magnetoelastic resonators include not only the mechanical design but also electromagnetic transparency, adaptability of form factor with appropriate feature size, and chemical inertness and/or biocompatibility. In this thesis, the packaging of magnetoelastic resonators is investigated in two contexts: environmental sensing and biomedical sensing. The first context is for tagging and mapping applications in a high temperature (≥ 150°C), high pressure (≥ 10 MPa), corrosive environment, such as a hydraulic fracture branching from a wellbore. This work utilizes for the first time a micro molding process to thermoform liquid crystal polymer (LCP) packages for protecting magnetoelastic resonators. The package is < 10 mm3 and includes micron-scale features to support the resonator and allow it to vibrate with low loss. It has an average shear strength of 60 N, and can endure pressure up to 2000 psi (≈13.8 MPa). The second context is for implantable magnetoelastic resonators, which are used for sensing biological parameters. These packages must: protect the sensors during deployment through an endoscope, be biocompatible and chemically inert, be able to pass through a complex delivery path, and fit within a limited size. Protecting the resonator during delivery while still allowing interaction with biological fluids is achieved with polymeric packages incorporating features such as a perforated housing and tapered and smoothed edges. This approach also includes features to aid in assembling with plastic stents via polyethylene tethers. The packaged resonator must pass through a complex delivery path without damage due to bending, so the compromise between two architectures – one mechanically flexible (Type F) and one mechanically stiff (Type S) – is evaluated. The primary advantage of the Type F package is the flexibility of the package during the delivery process while that of the Type S package is to maintain a strong signal even when the stent is in a curved bile duct. The length, width, and maximum thickness of the Type F package are 26.40 mm, 2.30 mm and 0.53 mm, respectively. The Type S package has an outer diameter of 2.54 mm, a length of 15 mm, and a maximum thickness of 0.74 mm. The two package types are tested in benchtop flexibility tests, and in vivo and in situ in porcine specimens. The animal tests demonstrate partial functionality of both types of packages, while also indicating that smaller and more elastic package designs are needed. Remaining in the implantable sensor context, an improved and miniaturized resonator design is explored. Miniaturizing the resonator accordingly allows miniaturization of the packaging, reducing the impact on the overall functionality of the medical device. The fabricated sensor is 8.25 mm long, 1 mm wide with the largest thickness of 218 μm. The resonant frequency of the resonator is around 173 kHz which is similar to that of a 12.5 mm long ribbon sensor. This resonator design is self-biased, simplifying the packaging and assembly compared to previous designs.