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The pitfalls of empirical fitting of glass relaxation data with stretched exponents

dc.contributor.authorAtzmon, Michael
dc.date.accessioned2020-10-14T21:35:29Z
dc.date.available2020-10-14T21:35:29Z
dc.date.issued2018-02-09
dc.identifier.citationJ. Appl. Phys. 123, 065103 (2018).en_US
dc.identifier.urihttps://hdl.handle.net/2027.42/163330
dc.description.abstractA stretched exponent is commonly used to fit experimental relaxation data for glasses, which typically exhibit a range of time constants. While it has been supported by theory for various processes, mostly near and above the glass transition temperature, Tg, it is also commonly used in phenomenological fits below Tg without a mechanistic model. The properties of the stretched exponent, and sample data for the enthalpy release and dynamic-mechanical response of metallic glasses, are used to show that in the absence of a mechanistic model, stretched-exponent fits easily lead to artifacts and flawed conclusions.en_US
dc.description.sponsorshipNational Science Foundationen_US
dc.language.isoen_USen_US
dc.publisherAmerican Institute of Physicsen_US
dc.titleThe pitfalls of empirical fitting of glass relaxation data with stretched exponentsen_US
dc.typeArticleen_US
dc.subject.hlbsecondlevelMaterials Science and Engineering
dc.subject.hlbtoplevelEngineering
dc.description.peerreviewedPeer Revieweden_US
dc.contributor.affiliationumNuclear Engineering and Radiological Sciences, Department ofen_US
dc.contributor.affiliationumMaterials Science and Engineering, Department ofen_US
dc.contributor.affiliationumcampusAnn Arboren_US
dc.description.bitstreamurlhttp://deepblue.lib.umich.edu/bitstream/2027.42/163330/1/Atzmon JAP 2018.pdfen_US
dc.identifier.sourceJournal of Applied Physicsen_US
dc.description.mapping-1en_US
dc.identifier.orcidhttps://orcid.org/0000-0002-7055-1313en_US
dc.description.filedescriptionDescription of Atzmon JAP 2018.pdf : Article
dc.description.depositorSELFen_US
dc.identifier.name-orcidAtzmon, Michael; 0000-0002-7055-1313en_US
dc.owningcollnameMaterials Science and Engineering, Department of


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