Microstructural studies of sputter-deposited TiN ceramic films
dc.contributor.author | Pelton, A. R. | en_US |
dc.contributor.author | Dabrowski, B. W. | en_US |
dc.contributor.author | Lehman, L. P. | en_US |
dc.contributor.author | Ernsberger, C. | en_US |
dc.contributor.author | Mansfield, John F. | en_US |
dc.date.accessioned | 2006-04-07T20:49:11Z | |
dc.date.available | 2006-04-07T20:49:11Z | |
dc.date.issued | 1989-05-02 | en_US |
dc.identifier.citation | Pelton, A. R., Dabrowski, B. W., Lehman, L. P., Ernsberger, C., Mansfield, J. F. (1989/05/02)."Microstructural studies of sputter-deposited TiN ceramic films." Ultramicroscopy 29(1-4): 50-59. <http://hdl.handle.net/2027.42/27938> | en_US |
dc.identifier.uri | http://www.sciencedirect.com/science/article/B6TW1-46JGMMR-FH/2/15ea7a61d77eac22444f570899024443 | en_US |
dc.identifier.uri | https://hdl.handle.net/2027.42/27938 | |
dc.description.abstract | A transmission electron microscopy study was undertaken to characterize the microstructures of TiN thin films that were sputter-deposited onto Cu-Be, alumina and glass substrates. There were no substantial microstructural differences observed among the films; the average grain size was 150 nm and the grains were surrounded by growth defect voids which are characteristic of Type-T microstructures. For comparison, the microstructure of TiN that was directly deposited onto carbon-coated TEM grids was also characterized. These films also contained grain-boundary voids, although the average grain size was only 15 nm. A prominent feature of the films deposited on the three substrates was the presence of intragranular microcracks which were usually associated with grain-boundary cusps or facets. These cusps were observed to lie on {220} planes with arrays of microcracks emanating from them with a periodicity of approximately 10 nm. It was speculated that due to the extremely high residual stress in these films, these cusps act as stress raisers that promote the formation of the microcracks. | en_US |
dc.format.extent | 849022 bytes | |
dc.format.extent | 3118 bytes | |
dc.format.mimetype | application/pdf | |
dc.format.mimetype | text/plain | |
dc.language.iso | en_US | |
dc.publisher | Elsevier | en_US |
dc.title | Microstructural studies of sputter-deposited TiN ceramic films | en_US |
dc.type | Article | en_US |
dc.rights.robots | IndexNoFollow | en_US |
dc.subject.hlbsecondlevel | Natural Resources and Environment | en_US |
dc.subject.hlbsecondlevel | Molecular, Cellular and Developmental Biology | en_US |
dc.subject.hlbsecondlevel | Ecology and Evolutionary Biology | en_US |
dc.subject.hlbtoplevel | Health Sciences | en_US |
dc.subject.hlbtoplevel | Science | en_US |
dc.description.peerreviewed | Peer Reviewed | en_US |
dc.contributor.affiliationum | University of Michigan Electron Microbeam Analysis Laboratory, Ann Arbor, Michigan 48109-2143, USA | en_US |
dc.contributor.affiliationother | Department of Materials Science and Engineering, University of Notre Dame, Notre Dame, Indiana 46556, USA | en_US |
dc.contributor.affiliationother | Department of Materials Science and Engineering, University of Notre Dame, Notre Dame, Indiana 46556, USA | en_US |
dc.contributor.affiliationother | Department of Materials Science and Engineering, University of Notre Dame, Notre Dame, Indiana 46556, USA | en_US |
dc.contributor.affiliationother | CTS Corporation, Elkhart, Indiana 46514, USA | en_US |
dc.description.bitstreamurl | http://deepblue.lib.umich.edu/bitstream/2027.42/27938/1/0000364.pdf | en_US |
dc.identifier.doi | http://dx.doi.org/10.1016/0304-3991(89)90230-1 | en_US |
dc.identifier.source | Ultramicroscopy | en_US |
dc.owningcollname | Interdisciplinary and Peer-Reviewed |
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