Laser-driven micro-explosive bonding of aluminium films to copper and silicon
dc.contributor.author | Was, Gary S. | en_US |
dc.contributor.author | Alexander, Dale E. | en_US |
dc.contributor.author | Mayer, Frederick J. | en_US |
dc.date.accessioned | 2006-09-11T15:08:58Z | |
dc.date.available | 2006-09-11T15:08:58Z | |
dc.date.issued | 1988-06 | en_US |
dc.identifier.citation | Alexander, Dale E.; Was, Gary S.; Mayer, Fred J.; (1988). "Laser-driven micro-explosive bonding of aluminium films to copper and silicon." Journal of Materials Science 23(6): 2181-2186. <http://hdl.handle.net/2027.42/44689> | en_US |
dc.identifier.issn | 1573-4803 | en_US |
dc.identifier.issn | 0022-2461 | en_US |
dc.identifier.uri | https://hdl.handle.net/2027.42/44689 | |
dc.description.abstract | Laser explosive microfabrication was used to bond micrometre-thick aluminium films to both copper and silicon substrates. Bonding was observed in both systems for laser intensities greater than about 1 × 10 9 W cm −2 and resulted in contiguous, uniform films when performed in a rough vacuum of 25 to 70 millitorr. At intensities greater than 9 × 109 W cm-2 the transferred films were generally black in colour due to oxidation in the aluminium-on-copper shots and due to substrate vaporization in the aluminium-on-silicon shots. SEM examination of the bond interfaces indicated mixing of film and substrate through wave formation and possibly through liquid-phase mixing due to thermal conduction of the laser pulse. Tape adhesion testing of the laser-bonded films showed a significant increase in adhesion over vapour-deposited films in both Al-Cu and Al-Si. Vapour-deposited films were easily removed in their entirety by a single tape pull while metallic portions of the laser-bonded films resisted removal by the tape in all but two tests. The enhanced adhesion evident in the laser-bonded films was a result of intermixing observed at the film-substrate interface. | en_US |
dc.format.extent | 684470 bytes | |
dc.format.extent | 3115 bytes | |
dc.format.mimetype | application/pdf | |
dc.format.mimetype | text/plain | |
dc.language.iso | en_US | |
dc.publisher | Kluwer Academic Publishers; Chapman and Hall Ltd. ; Springer Science+Business Media | en_US |
dc.subject.other | Polymer Sciences | en_US |
dc.subject.other | Chemistry | en_US |
dc.subject.other | Industrial Chemistry/Chemical Engineering | en_US |
dc.subject.other | Characterization and Evaluation Materials | en_US |
dc.subject.other | Mechanics | en_US |
dc.title | Laser-driven micro-explosive bonding of aluminium films to copper and silicon | en_US |
dc.type | Article | en_US |
dc.subject.hlbsecondlevel | Materials Science and Engineering | en_US |
dc.subject.hlbsecondlevel | Engineering (General) | en_US |
dc.subject.hlbtoplevel | Engineering | en_US |
dc.description.peerreviewed | Peer Reviewed | en_US |
dc.contributor.affiliationum | Department of Nuclear Engineering, University of Michigan, 48109, Ann Arbor, Michigan, USA | en_US |
dc.contributor.affiliationum | Department of Nuclear Engineering, University of Michigan, 48109, Ann Arbor, Michigan, USA | en_US |
dc.contributor.affiliationother | KMS Fusion Inc., 3621, S. State, 48104, Ann Arbor, Michigan, USA | en_US |
dc.contributor.affiliationumcampus | Ann Arbor | en_US |
dc.description.bitstreamurl | http://deepblue.lib.umich.edu/bitstream/2027.42/44689/1/10853_2005_Article_BF01115786.pdf | en_US |
dc.identifier.doi | http://dx.doi.org/10.1007/BF01115786 | en_US |
dc.identifier.source | Journal of Materials Science | en_US |
dc.owningcollname | Interdisciplinary and Peer-Reviewed |
Files in this item
Remediation of Harmful Language
The University of Michigan Library aims to describe library materials in a way that respects the people and communities who create, use, and are represented in our collections. Report harmful or offensive language in catalog records, finding aids, or elsewhere in our collections anonymously through our metadata feedback form. More information at Remediation of Harmful Language.
Accessibility
If you are unable to use this file in its current format, please select the Contact Us link and we can modify it to make it more accessible to you.