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High resolution electron microscopy of ordered polymers and organic molecular crystals: Recent developments and future possibilities

dc.contributor.authorMartin, David C.en_US
dc.contributor.authorChen, Jihuaen_US
dc.contributor.authorYang, Junyanen_US
dc.contributor.authorDrummy, Lawrence F.en_US
dc.contributor.authorKübel, Christianen_US
dc.date.accessioned2006-09-20T15:02:27Z
dc.date.available2006-09-20T15:02:27Z
dc.date.issued2005-07-15en_US
dc.identifier.citationMartin, David C.; Chen, Jihua; Yang, Junyan; Drummy, Lawrence F.; KÜbel, Christian (2005)."High resolution electron microscopy of ordered polymers and organic molecular crystals: Recent developments and future possibilities." Journal of Polymer Science Part B: Polymer Physics 43(14): 1749-1778. <http://hdl.handle.net/2027.42/48693>en_US
dc.identifier.issn0887-6266en_US
dc.identifier.issn1099-0488en_US
dc.identifier.urihttps://hdl.handle.net/2027.42/48693
dc.description.abstractHigh Resolution Electron Microscopy (HREM) has made it possible to directly image the detailed organization of a variety of polymers and organic molecular crystals. For organic materials it is imperative to use low dose techniques that minimize the structural reorganizations that inevitably occur during electron beam irradiation. This article reviews recent developments in low dose HREM from our own laboratory and elsewhere. The developments in closely related microstructural characterization techniques are also reviewed. In the future, the ability to correct the spherical aberration of the objective lens, the use of low voltages to increase contrast, and the use of time-resolved techniques are expected to open new avenues for the ultrastructural investigations of organic materials. New sample preparation techniques, such as the ability to make thin samples by focused ion beam (FIBs), to cut samples with an oscillating diamond knife, and to more conveniently prepare cryogenically solidified specimens, are also expected to be of increasing importance. © 2005 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 43: 1749–1778, 2005en_US
dc.format.extent3404961 bytes
dc.format.extent3118 bytes
dc.format.mimetypeapplication/pdf
dc.format.mimetypetext/plain
dc.language.isoen_US
dc.publisherWiley Subscription Services, Inc., A Wiley Companyen_US
dc.subject.otherChemistryen_US
dc.subject.otherPolymer and Materials Scienceen_US
dc.titleHigh resolution electron microscopy of ordered polymers and organic molecular crystals: Recent developments and future possibilitiesen_US
dc.typeArticleen_US
dc.rights.robotsIndexNoFollowen_US
dc.subject.hlbsecondlevelMaterials Science and Engineeringen_US
dc.subject.hlbtoplevelEngineeringen_US
dc.description.peerreviewedPeer Revieweden_US
dc.contributor.affiliationumMacromolecular Science and Engineering, 2022 H. H. Dow Building, The University of Michigan, Ann Arbor, MI 48109-2136 ; Materials Science and Engineering, 2022 H. H. Dow Building, The University of Michigan, Ann Arbor, MI 48109-2136 ; Biomedical Engineering, 2022 H. H. Dow Building, The University of Michigan, Ann Arbor, MI 48109-2136 ; Macromolecular Science and Engineering, 2022 H. H. Dow Building, The University of Michigan, Ann Arbor, MI 48109-2136en_US
dc.contributor.affiliationumMacromolecular Science and Engineering, 2022 H. H. Dow Building, The University of Michigan, Ann Arbor, MI 48109-2136en_US
dc.contributor.affiliationumMaterials Science and Engineering, 2022 H. H. Dow Building, The University of Michigan, Ann Arbor, MI 48109-2136en_US
dc.contributor.affiliationotherWright Patterson Air Force Base, Materials and Manufacturing Directorate, Dayton, OHen_US
dc.contributor.affiliationotherFraunhofer-Institut fÜr Fertigungstechnik und Angewandte Material forschung, Wiener Straße 12, 28359 Bremen, Germanyen_US
dc.description.bitstreamurlhttp://deepblue.lib.umich.edu/bitstream/2027.42/48693/1/20419_ftp.pdfen_US
dc.identifier.doihttp://dx.doi.org/10.1002/polb.20419en_US
dc.identifier.sourceJournal of Polymer Science Part B: Polymer Physicsen_US
dc.owningcollnameInterdisciplinary and Peer-Reviewed


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