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A micromachined 2D positioner with electrothermal actuation and sub-nanometer capacitive sensing

dc.contributor.authorChu, Larry L.en_US
dc.contributor.authorGianchandani, Yogesh B.en_US
dc.date.accessioned2006-12-19T19:09:28Z
dc.date.available2006-12-19T19:09:28Z
dc.date.issued2003-03-01en_US
dc.identifier.citationChu, Larry L; Gianchandani, Yogesh B (2003). "A micromachined 2D positioner with electrothermal actuation and sub-nanometer capacitive sensing." Journal of Micromechanics and Microengineering. 13(2): 279-285. <http://hdl.handle.net/2027.42/49040>en_US
dc.identifier.issn0960-1317en_US
dc.identifier.urihttps://hdl.handle.net/2027.42/49040
dc.description.abstractThis paper reports on a multi-purpose two-axis micropositioner with sub-nanometer position sensing for precise feedback control. Along each axis it has an electrothermal actuator, a capacitive position sensor and a displacement amplifier that provides a gain of 3.37 for the sensor. It is fabricated from custom SOI wafers using dry etching, and each component is electrically and thermally isolated by silicon nitride. For a fabricated device of 65 μm thickness, the measured displacement sensitivity is 0.333 fF nm−1, which corresponds to 0.3 nm resolution with available laboratory instrumentation. The range is ≈19 μm along each axis for the positioner, which corresponds to 66 μm travel in the sense combs. Using an external parallel inductor, a positioning displacement of 9.6 μm offers a shift of 240 kHz in L–C resonance, corresponding to a sensitivity of 25 Hz nm−1.en_US
dc.format.extent3118 bytes
dc.format.extent398972 bytes
dc.format.mimetypetext/plain
dc.format.mimetypeapplication/pdf
dc.language.isoen_US
dc.publisherIOP Publishing Ltden_US
dc.titleA micromachined 2D positioner with electrothermal actuation and sub-nanometer capacitive sensingen_US
dc.typeArticleen_US
dc.subject.hlbsecondlevelPhysicsen_US
dc.subject.hlbtoplevelScienceen_US
dc.description.peerreviewedPeer Revieweden_US
dc.contributor.affiliationumDepartment of Electrical and Computer Engineering, University of Wisconsin, Madison, WI, USA; EECS Department, University of Michigan, Ann Arbor, MI, USAen_US
dc.contributor.affiliationotherDepartment of Electrical and Computer Engineering, University of Wisconsin, Madison, WI, USAen_US
dc.contributor.affiliationumcampusAnn Arboren_US
dc.description.bitstreamurlhttp://deepblue.lib.umich.edu/bitstream/2027.42/49040/2/jm3216.pdfen_US
dc.identifier.doihttp://dx.doi.org/10.1088/0960-1317/13/2/316en_US
dc.identifier.sourceJournal of Micromechanics and Microengineering.en_US
dc.owningcollnameInterdisciplinary and Peer-Reviewed


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