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Thermal and mechanical cracking in bis(triisopropylsilylethnyl) pentacene thin films

dc.contributor.authorChen, Jihuaen_US
dc.contributor.authorTee, Chee Keongen_US
dc.contributor.authorYang, Junyanen_US
dc.contributor.authorShaw, Charles Michaelen_US
dc.contributor.authorShtein, Maxen_US
dc.contributor.authorAnthony, Johnen_US
dc.contributor.authorMartin, David C.en_US
dc.date.accessioned2007-09-20T17:58:40Z
dc.date.available2008-01-03T16:21:59Zen_US
dc.date.issued2006-12-15en_US
dc.identifier.citationChen, Jihua; Tee, Chee Keong; Yang, Junyan; Shaw, Charles; Shtein, Max; Anthony, John; Martin, David C. (2006). "Thermal and mechanical cracking in bis(triisopropylsilylethnyl) pentacene thin films." Journal of Polymer Science Part B: Polymer Physics 44(24): 3631-3641. <http://hdl.handle.net/2027.42/55893>en_US
dc.identifier.issn0887-6266en_US
dc.identifier.issn1099-0488en_US
dc.identifier.urihttps://hdl.handle.net/2027.42/55893
dc.description.abstractBis(triisopropylsilylethnyl) pentacene (TIPS pentacene) was synthesized to increase its solubility in common liquid solvents and, at the same time, enhance the Π–Π stacking between neighboring acenes in the crystallized state in comparison with unmodified pentacene. Hot-stage microscopy experiments revealed that during heating voids develop along the long axis of the TIPS pentacene films {along the [210] direction/parallel to the ( 120 ) planes} and crystals overlap along the short axis {along the [ 120 ] direction/parallel to the (210) planes}. From molecular mechanics simulations, the predominant twin boundaries of ( 120 ) and commonly observed cracking planes of (120), ( 120 ), and (210) had relatively low surface energies in comparison with planes with similar Miller indices. Organic thin-film transistors with TIPS pentacene as the active layer were fabricated, and the mobility values decreased from 0.4–1.0 cm 2 /V s before cracking to ∼0.2 cm 2 /V s after cracking. To maintain the high charge carrier mobility of TIPS pentacene devices, these cracks should be avoided. © 2006 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 44: 3631–3641, 2006en_US
dc.format.extent1045206 bytes
dc.format.extent3118 bytes
dc.format.mimetypeapplication/pdf
dc.format.mimetypetext/plain
dc.publisherWiley Subscription Services, Inc., A Wiley Companyen_US
dc.subject.otherChemistryen_US
dc.subject.otherPolymer and Materials Scienceen_US
dc.titleThermal and mechanical cracking in bis(triisopropylsilylethnyl) pentacene thin filmsen_US
dc.typeArticleen_US
dc.rights.robotsIndexNoFollowen_US
dc.subject.hlbsecondlevelMaterials Science and Engineeringen_US
dc.subject.hlbtoplevelEngineeringen_US
dc.description.peerreviewedPeer Revieweden_US
dc.contributor.affiliationumMacromolecular Science and Engineering Center, University of Michigan, Ann Arbor, Michigan 48109en_US
dc.contributor.affiliationumDepartment of Electrical Engineering and Computer Science, University of Michigan, Ann Arbor, Michigan 48109en_US
dc.contributor.affiliationumDepartment of Materials Science and Engineering, University of Michigan, Ann Arbor, Michigan 48109en_US
dc.contributor.affiliationumMacromolecular Science and Engineering Center, University of Michigan, Ann Arbor, Michigan 48109en_US
dc.contributor.affiliationumDepartment of Materials Science and Engineering, University of Michigan, Ann Arbor, Michigan 48109en_US
dc.contributor.affiliationumMacromolecular Science and Engineering Center, University of Michigan, Ann Arbor, Michigan 48109 ; Department of Materials Science and Engineering, University of Michigan, Ann Arbor, Michigan 48109 ; Department of Biomedical Engineering, University of Michigan, Ann Arbor, Michigan 48109 ; Macromolecular Science and Engineering Center, University of Michigan, Ann Arbor, Michigan 48109en_US
dc.contributor.affiliationotherDepartment of Chemistry, University of Kentucky, Lexington, Kentucky 40506en_US
dc.description.bitstreamurlhttp://deepblue.lib.umich.edu/bitstream/2027.42/55893/1/21007_ftp.pdfen_US
dc.identifier.doihttp://dx.doi.org/10.1002/polb.21007en_US
dc.identifier.sourceJournal of Polymer Science Part B: Polymer Physicsen_US
dc.owningcollnameInterdisciplinary and Peer-Reviewed


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