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Signal-Amplifying Conjugated Polymer–DNA Hybrid Chips We appreciate financial support from the National Science Foundation (BES 0428010) and the equipment grant from the University of Michigan College of Engineering. J.K. and K.L. also acknowledge the Ilju Foundation for the Ilju scholarship.
dc.contributor.authorLee, Kangwonen_US
dc.contributor.authorRouillard, Jean-Marieen_US
dc.contributor.authorPham, Trinhen_US
dc.contributor.authorGulari, Erdoganen_US
dc.contributor.authorKim, Jinsangen_US
dc.date.accessioned2007-09-20T18:42:28Z
dc.date.available2008-09-08T14:25:12Zen_US
dc.date.issued2007-06-18en_US
dc.identifier.citationLee, Kangwon; Rouillard, Jean-Marie; Pham, Trinh; Gulari, Erdogan; Kim, Jinsang (2007)."Signal-Amplifying Conjugated Polymer–DNA Hybrid Chips We appreciate financial support from the National Science Foundation (BES 0428010) and the equipment grant from the University of Michigan College of Engineering. J.K. and K.L. also acknowledge the Ilju Foundation for the Ilju scholarship. ." Angewandte Chemie 119(25): 4751-4754. <http://hdl.handle.net/2027.42/56058>en_US
dc.identifier.issn0044-8249en_US
dc.identifier.issn1521-3757en_US
dc.identifier.urihttps://hdl.handle.net/2027.42/56058
dc.description.abstractNo Abstracten_US
dc.format.extent543199 bytes
dc.format.extent3118 bytes
dc.format.mimetypeapplication/pdf
dc.format.mimetypetext/plain
dc.publisherWILEY-VCH Verlagen_US
dc.subject.otherChemistryen_US
dc.subject.otherGeneral Chemistryen_US
dc.titleSignal-Amplifying Conjugated Polymer–DNA Hybrid Chips We appreciate financial support from the National Science Foundation (BES 0428010) and the equipment grant from the University of Michigan College of Engineering. J.K. and K.L. also acknowledge the Ilju Foundation for the Ilju scholarship.en_US
dc.typeArticleen_US
dc.rights.robotsIndexNoFollowen_US
dc.subject.hlbsecondlevelChemical Engineeringen_US
dc.subject.hlbsecondlevelChemistryen_US
dc.subject.hlbsecondlevelMaterials Science and Engineeringen_US
dc.subject.hlbtoplevelEngineeringen_US
dc.subject.hlbtoplevelScienceen_US
dc.description.peerreviewedPeer Revieweden_US
dc.contributor.affiliationumDepartment of Materials Science and Engineering, University of Michigan, 2300 Hayward St., Ann Arbor, MI 48109, USA, Fax: (+1) 734-936-4681en_US
dc.contributor.affiliationumDepartment of Chemical Engineering, University of Michigan, 2300 Hayward St., Ann Arbor, MI 48109, USAen_US
dc.contributor.affiliationumDepartment of Chemical Engineering, University of Michigan, 2300 Hayward St., Ann Arbor, MI 48109, USAen_US
dc.contributor.affiliationumDepartment of Chemical Engineering, University of Michigan, 2300 Hayward St., Ann Arbor, MI 48109, USAen_US
dc.contributor.affiliationumDepartment of Materials Science and Engineering, University of Michigan, 2300 Hayward St., Ann Arbor, MI 48109, USA, Fax: (+1) 734-936-4681 ; Department of Chemical Engineering, University of Michigan, 2300 Hayward St., Ann Arbor, MI 48109, USA ;en_US
dc.description.bitstreamurlhttp://deepblue.lib.umich.edu/bitstream/2027.42/56058/1/4751_ftp.pdfen_US
dc.identifier.doihttp://dx.doi.org/10.1002/ange.200700419en_US
dc.identifier.sourceAngewandte Chemieen_US
dc.owningcollnameInterdisciplinary and Peer-Reviewed


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