Cure versus Flow in Dispersed Chip-Underfill Materials

Abstract

The relative stability of chip-underfill composite materials was modeled as a function of glass filler concentration between 10 and 70 wt.-%, filler particle size (between 5 and 25 microns), and the curing temperature of the resin (150 vs. 180 °C), yielding different dynamic viscosity profiles. The stability was gauged using a modified sigmoidal chemorheology model for the dynamic viscosity, and incorporating the time-dependent viscosity into a model for Stokes' law of sedimentation. We also incorporated a hindered sedimentation term, due to filler concentration due to the higher loadings. Several important findings were observed. First, it appears to be the high concentration of filler that is maintaining the stability of these dispersions during cure. Smaller concentrations of the same particles were predicted to have a larger sedimentation velocity leading to stratification in the resin with time. Second, higher cure temperatures led to a shorter period of sedimentation in a pre-cured state and resulted in less sedimentation, even though there was probably a slightly smaller viscosity in the pre-cured condition. While these process models adequately describe the physics of the competitive processes of cure and sedimentation, a full picture may be incomplete without a larger determination of how this also affects polymerization shrinkage and residual shear stress upon cure.