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Transition from lateral to transverse phase separation during film co‐deposition

dc.contributor.authorAdams, C. D.en_US
dc.contributor.authorAtzmon, Michaelen_US
dc.contributor.authorCheng, Y. ‐t.en_US
dc.contributor.authorSrolovitz, David J.en_US
dc.date.accessioned2010-05-06T21:36:53Z
dc.date.available2010-05-06T21:36:53Z
dc.date.issued1991-11-11en_US
dc.identifier.citationAdams, C. D.; Atzmon, M.; Cheng, Y.‐T.; Srolovitz, D. J. (1991). "Transition from lateral to transverse phase separation during film co‐deposition." Applied Physics Letters 59(20): 2535-2537. <http://hdl.handle.net/2027.42/70088>en_US
dc.identifier.urihttps://hdl.handle.net/2027.42/70088
dc.descriptionCopyright 1991 American Institute of Physics. This article may be downloaded for personal use only. Any other use requires prior permission of the author and the American Institute of Physics. The article originally appeared in Applied Physics Letters 59, 2535 (1991) and may be found at http://apl.aip.org/resource/1/applab/v59/i20/p2535_s1.
dc.description.abstractWe report observations of two distinct types of phase‐separated microstructures in co‐deposited Al‐Ge films. In the initial stages of growth, lateral phase separation is observed, with a temperature dependence consistent with surface diffusion. As the film grows thicker, the Ge‐rich phase becomes increasingly buried, and a transverse phase‐separated microstructure results, consisting of an Al‐rich layer covering a Ge‐rich layer. This observation is explained in terms of the competition between surface and interfacial free energies. We discuss the kinetic aspects of the phase separation process, and the resulting behavior in the thick‐film limit.en_US
dc.format.extent3102 bytes
dc.format.extent505938 bytes
dc.format.mimetypetext/plain
dc.format.mimetypeapplication/pdf
dc.publisherThe American Institute of Physicsen_US
dc.rights© The American Institute of Physicsen_US
dc.titleTransition from lateral to transverse phase separation during film co‐depositionen_US
dc.typeArticleen_US
dc.subject.hlbsecondlevelPhysicsen_US
dc.subject.hlbtoplevelScienceen_US
dc.description.peerreviewedPeer Revieweden_US
dc.contributor.affiliationumDepartment of Materials Science and Engineering, University of Michigan, Ann Arbor, Michigan 48109en_US
dc.contributor.affiliationumDepartment of Nuclear Engineering, University of Michigan, Ann Arbor, Michigan 48109en_US
dc.contributor.affiliationumGeneral Motors Research Laboratories, Physical Chemistry Dept., Warren, Michigan 48090‐9055en_US
dc.contributor.affiliationumDepartment of Materials Science and Engineering, University of Michigan, Ann Arbor, Michigan 48109en_US
dc.description.bitstreamurlhttp://deepblue.lib.umich.edu/bitstream/2027.42/70088/2/APPLAB-59-20-2535-1.pdf
dc.identifier.doi10.1063/1.105944en_US
dc.identifier.sourceApplied Physics Lettersen_US
dc.identifier.citedreferenceC. D. Adams, M. Atzmon, Y.-T. Cheng, and D. J. Srolovitz, in Thin Film Structures and Phase Stability, edited by B. M. Clemens and W. L. Johnson, Mater. Res. Soc. Symp. Proa, Vol. 187 (Materials Research Society, Pittsburgh, 1990), p. 33.en_US
dc.identifier.citedreferenceM. Atzmon, C. D. Adams, Y.-T. Cheng, and D. J. Srolovitz, in Evolution of Thin Film and Surface Microstructure, edited by C. V. Thompson, J. Y. Tsao, arid D. J. Srolovitz, Mater. Res. Soc. Symp. Proa, Vol. 202 (Materials Research Society, Pittsburgh, 1991), p. 143.en_US
dc.identifier.citedreferenceBinary Alloy Phase Diagrams, edited by T. B. Massalski (ASM, Metals Park, 1986), p. 116.en_US
dc.identifier.citedreferenceB. Dwir and G. Deutscher, in Proceedings of International Workshop on Novel Mechanism of Superconductivity, edited by S. A. Wolf and V. Z. Kresin (Plenum, NY, 1987), p. 23.en_US
dc.identifier.citedreferenceS. S. Lau and W. F. van der Wege, in Thin Films—Interdiffusion and Reactions, edited by J. M. Poate, K. N. Tu, and J. W. Mayer (Wiley, New York, 1978), p. 433.en_US
dc.identifier.citedreferenceW. W. Mullins and R. F. Sekerka, J. Appl. Phys. 34, 323 (1963); 35, 444 (1964).en_US
dc.owningcollnamePhysics, Department of


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