Robotic 3D Tetris
dc.contributor.author | Berman, Joseph | |
dc.contributor.author | Gurlik, Travis | |
dc.contributor.author | Lau, Shannon | |
dc.contributor.author | Moon, Hannah | |
dc.contributor.author | Raman, Arjun | |
dc.contributor.author | Wong, Jonathan | |
dc.date.accessioned | 2021-04-29T19:12:08Z | |
dc.date.available | 2021-04-29T19:12:08Z | |
dc.date.issued | 2020 | |
dc.identifier.uri | https://hdl.handle.net/2027.42/167245 | |
dc.identifier.uri | https://youtu.be/8ph5tV9JWUg | |
dc.description.abstract | The Comau 3D Bin Packer is an integrated software and hardware system that automates placing items into a container with a robot using computer vision, modern segmentation techniques, and a team-designed bin packing algorithm. The system detects incoming objects with a point cloud camera, measures their dimensions, computes their optimal placement, and communicates this placement to both a robot for physical placement and the graphical user interface for visualization. The physical system consists of two depth cameras connected to a Raspberry Pi, which handles segmentation, and a computer with a display that handles the bin packing algorithm and the user interface. | |
dc.subject | computer vision | |
dc.subject | optimization | |
dc.subject | graphical user interface | |
dc.subject | TCP/IP | |
dc.title | Robotic 3D Tetris | |
dc.type | Technical Report | |
dc.subject.hlbtoplevel | Engineering | |
dc.contributor.affiliationum | Computer Science and Data Science | |
dc.contributor.affiliationum | Computer Science | |
dc.contributor.affiliationum | Computer Science and Mathematics | |
dc.contributor.affiliationum | Electrical Engineering | |
dc.description.bitstreamurl | http://deepblue.lib.umich.edu/bitstream/2027.42/167245/1/Gurlik-Travis_Honors-Capstone-Report-Travis_Gurlik.pdf | |
dc.description.bitstreamurl | http://deepblue.lib.umich.edu/bitstream/2027.42/167245/2/Gurlik-Travis_Honors-Capstone-Presentation-Travis_Gurlik.pdf | |
dc.identifier.doi | https://dx.doi.org/10.7302/920 | |
dc.working.doi | 10.7302/920 | en |
dc.owningcollname | Honors Program, The College of Engineering |
Files in this item
Remediation of Harmful Language
The University of Michigan Library aims to describe library materials in a way that respects the people and communities who create, use, and are represented in our collections. Report harmful or offensive language in catalog records, finding aids, or elsewhere in our collections anonymously through our metadata feedback form. More information at Remediation of Harmful Language.
Accessibility
If you are unable to use this file in its current format, please select the Contact Us link and we can modify it to make it more accessible to you.